| 摘要 |
1535864 Tool holders; sensors KISTLER INSTRUMENTE AG 29 April 1976 [16 May 1975] 17558/76 Headings B3B and B3T [Also in Division B5] A method of producing semi-conductor crystal members comprises treating surface parts by chip removing machining methods. The crystal member may be in the form of measuring cell consisting of a plate 18, Fig. 5, containing a reference space 19, which is formed by the method of the invention, the plate being secured to a base plate 20 which may also be of semi-conductor material. The space 19 forms a diaphragm 23 which upon deflection by a pressure P causes a voltage output to be produced by resistance paths 22. The plate 25, Fig. 6, is mounted on a synthetic insert 26 of a mandrel 27 held in the chuck 28 of a lathe and the space is formed by a turning tool consisting of a single crystal 34, for example of diamond, corundrum or silicon carbide, having a hardness of at least 9 Mohs. The tool is soldered in a support 33, Figs. 7 and 8, and has a cutting edge 36 positioned accurately to be perpendicular to the axis of rotation of the plate and a length R greater than half the diameter D of the space. The tool has a clearance angleγof approximately 5 degrees, a negative cutting angleαof approximately 8 degrees, and an incidence angle # of approximately 5 degrees. The support 33 is clamped to the machine support 40 by bolts 39 with the interposition of single or multi-component force measuring cells 38. A radial recess may be formed in the wall of the plate and the external surface of the plate may be formed by a crystal cutting tool to have a cylindrical surface 80, Fig. 11 and, if desired, a recess 82. |
