| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting board, without bringing about cracks at a resist part of the board or a wiring part, even when thermal stress is concentrated at an end of a reinforced resin layer, and to further provide a mounting structure for mounting a semiconductor device on the board with a long lifetime. SOLUTION: The mounting board for mounting the semiconductor device comprises a semiconductor element fixed to at least the board and a resin- encapsulating part for sealing the element. The board further comprises the wiring part, corresponding to the end of the reinforced resin layer provided between the semiconductor device and the board, so that the width and/or the thickness of the wiring is made larger than the width and/or the thickness of the wiring of another wiring part or a low elastic resin layer, provided on a surface of the board corresponding to the end of the resin layer, or the end of the part corresponding to the end of the resin layer is made to be located away from the end. The board further comprises a wiring via to enhance its resistively with respect to thermal stress. The mounting structure using the mounting board is provided. |
