| 摘要 |
1535195 Semi-conductor devices GENERAL ELECTRIC CO 19 Dec 1975 [23 Dec 1974] 52131/75 Heading H1K A semi-conductor device comprises a planar semi-conductor device chip 22 bonded to substantially co-extensive planar regions of metallic mounting plates 32, 33 which have peripheral edges that are not coplanar with said planar region so as to alleviate the effects of burrs 37 formed during manufacture of the mounting plates 32, 33. The mounting plates may be of Cu or Mo and they may be soldered to the device chip 22. The edges of the mounting plates are separated from the planar regions by transition regions 36 which may be straight, stepped or arcuate. One face of the device chip 22 may have ribbon contacts that bend away from the device chip 22 and terminate in flat portions that are coplanar with the outer face of the mounting plate on the opposite face of the chip 22, to facilitate attachment to a printed circuit board. |
