发明名称 SOLDERING APPARATUS
摘要 PURPOSE:To stabilize the height position of solder applied face, by providing the preliminary solder vessel and making the face of solder exhaust nozzle lower than opening face of the above vessel and then, sending the solder by the pressure of both head.
申请公布号 JPS53138953(A) 申请公布日期 1978.12.04
申请号 JP19770054541 申请日期 1977.05.11
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 TAKEMURA KATSUKI
分类号 H05K3/34;B23K1/08;B23K3/06 主分类号 H05K3/34
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