| 摘要 |
PURPOSE:To form a required conductive layer without side-etching by a method wherein a patterned metal layer and a patterned conductive layer are piled on an insulating substrate in their reverse order. CONSTITUTION:A metal layer 4A, piled on a conductive layer 4B, is formed on an insulating substrate 3 and etched by electrolytic etching using a mask layer 5 so that a patterned metal layer 7A is formed from the metal layer 4A. And then, a patterned conductive layer 7B is formed from the conductive layer 4B by etching other than electrolytic etching using the mask layer 5 or the patterned metal layer 7A as a mask. As a result, a conductive layer 10, in which the patterned metal layer 7A and the patterned conductive layer 7B are piled in their reverse order, is formed on the substrate 3 without side-etching. |
