| 摘要 |
<p>PURPOSE: To improve the adhesive properties, solvent resistance and the resistance to bulge by treating a copper foil with a certain type of silane compound and laminating a polymer at a temperature higher than the glass transition temperature of the polymer on a prepreg core of a polynorbornene copolymer. CONSTITUTION: A non-cellulose cloth is impregnated with a solution of a polymer obtained by polymerizing a norbornene monomer with various compound, dried until the solvent content becomes about 2.5 wt.% or less, and a prepreg is formed. It is pretreated with a copper foil silane compound, the prepreg is interposed between the two copper foils, and laminated at 1,100 psi or less and 250 deg.C or lower. The obtained printed circuit board has an improved delamination strength, and it has a resistance against a thermal stress at least for 20 sec in a solder bath at 260 deg.C without delamination and bulging of the copper.</p> |
