Method for assembling a multiple layer electronic assembly

摘要

Mechanisms for aligning electrical contacts of electronic components in a multiple layer electronic assembly are disclosed. A mounting plate is configured to align multiple layers of the multiple layer electronic assembly. The mounting plate includes a surface that a plurality of first anchor features at first predetermined locations of the surface configured to anchor a plurality of first layer electronic assemblies with respect to the surface. The mounting plate also includes a plurality of second anchor features at second predetermined locations configured to anchor at least one second layer electronic assembly with respect to the plurality of first layer electronic assemblies.

主权项

1. A method of assembling a multiple layer electronic assembly, comprising:
providing a mounting plate having a surface comprising:
a plurality of anchor openings at first predetermined locations; andat least two anchor pins at second predetermined locations; for each of a plurality of first layer electronic components:
inserting a pin that extends substantially perpendicularly from a first contact face of a compression connector through a reference opening of a respective first layer electronic component of the plurality of first layer electronic components to form a subassembly, the pin extending completely through the respective first layer electronic component and having an extension portion that extends beyond a bottom surface of the first layer electronic component; andmounting the subassembly with respect to the mounting plate by inserting the extension portion in a corresponding anchor opening of the mounting plate; and mounting a second layer electronic assembly on top of the subassemblies by aligning two pin receiving openings in the second layer electronic assembly with the corresponding at least two anchor pins of the mounting plate and sliding the second layer electronic assembly down the at least two anchor pins on top of the plurality of subassemblies.