| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer processing method which can effectively remove burrs formed on both sides of a laser processes groove formed by ablation processing.SOLUTION: A processing method of a wafer 2 in which a device is formed in a functional layer 21 laminated on a surface of a substrate 20 comprises the steps of: irradiating the wafer with laser beams of a wavelength having absorptivity to the wafer to perform ablation processing to remove the functional layer; and cutting the substrate by a cutting blade 523 along a region where the functional layer is removed to divide the wafer into individual devices. By jetting a pressurized fluid from a nozzle 541 arranged forward or backward of the cutting blade in a cutting feed direction, burrs 25 standing on both sides of a laser processed groove, which are formed in the ablation processing step are removed.SELECTED DRAWING: Figure 8 |
