| 摘要 |
A process of anchoring and assembly of contact springs of miniature relays provided for mounting on printed circuit boards is disclosed. Each electrode, associated with a contact spring, extends the latter outside the relay and includes a fixing lug provided with semicircular cuts determining two fixing fingers. Each electrode is inserted into a slot of the relay support wall and is submitted to a force which causes the semicircular cuts to be deformed. This results in both fingers away from each other, penetrating the relay support insulating material and housing therein by deforming this material within said cuts. |
