| 摘要 |
<p>New adhesive compositions are described which are capable of providing bonded assemblies at least one element of which is a metal and which are extremely resistant to deleterious environments, particularly atmospheric moisture and liquid water. The compositions include: (A) about 75 to 99% of any known adhesive composition based on a polymerizable liquid resin containing a compound having a terminal vinyl group, (b) about 0.5 to about 15%, by weight, of ethylenically unsaturated carboxylic acid and (C) about 0.54 to about 10%, by weight, of an organosilicon compound represented by the formula X3Si(CH2)mY in which m is an integer from 0 to 3, Y is an organo-functional group and X is a hydroxyzable group.</p> |
