发明名称 Desiccation of electronic enclosures using boron nitride hot sealing method
摘要 998,637. Semi-conductor devices. PHILCO CORPORATION. Nov. 11, 1963 [Nov. 9, 1962 (2)], No. 44369/63. Heading H1K. A semi-conductor or other electronic device is protected by an environmental material containing boron nitride. Fig. 1 shows a transistor in a sealed can 10 containing boron nitride powder 11 which acts as a dessicant and a heat conductor to cool the device. The boron nitride may be provided as a dispersion in silicone oil in the container. Fig. 3 shows a modification in which a thermoset epoxy resin or polystyrene web 14 containing boron nitride is applied to the junction area of a transistor to provide mechanical reinforcement.
申请公布号 US3241217(A) 申请公布日期 1966.03.22
申请号 US19620236545 申请日期 1962.11.09
申请人 PHILCO CORPORATION 发明人 NUNN JEROME C.
分类号 H01L23/26;H01L23/31 主分类号 H01L23/26
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