Dielectric imaging member

摘要

An improved dielectric imaging member comprising a transparent dielectric substrate having a thickness of between about 75 - 175 micrometers, a conductive layer on said substrate and a dielectric material having a thickness of less than about 15 micrometers on said conductive layer. An imaging process is also provided comprising generating an electrostatic latent image on said dielectric imaging member and developing said image by contact with a developer material.