Magnetic bubble memory package

摘要

A magnetic bubble domain package which insures a coplanar relationship between the signal leads and the active surface of the magnetic bubble domain chip and also insures the precise location of the magnetic bubble domain chip within the most uniform part of the rotating magnetic field. The package utilizes a thin film of insulating material and chip means secured to the film to produce the coplanar relationship between the active surface of the chip and the signal leads. The package also includes a plastic coil carrier member which supports the inner drive coil and which may be prewound in a separate manufacturing operation. The coil carrier member is attached to the insulating material/chip means assembly in such a way as to locate the chip precisely in the center of the inner coil wound thereon. The bias field for the package is produced by two permanent magnets and two bias plates secured exterior to the drive coils, and is adjustable by means of a screw of high-permeability material located within the package.