| 摘要 |
A semiconductor device of this invention comprises a semiconductor chip including a high power consumption portion, an internal lead wire connecting an electrode portion of the semiconductor chip with an external terminal, a soft material adhered to a substantially middle portion of the lead wire, and a moulding material for integrally moulding the semiconductor chip, lead wire, and soft material. Further, the semiconductor device includes a thermal fuse to prevent flaming of the device by cutting off the lead wire within the soft material in case the device is subjected to overcurrent. |
