| 摘要 |
<p>PURPOSE:To detect separation of wire ball by supplying a power from a gold wire through a ball. CONSTITUTION:A pad 15 is formed on a P layer 12 of a N type Si substrate 11 through an aperture of an insulating film 14. A substrate setting board 21 is grounded through a resistor 16 and a detecting output O1 can be obtained from the one end of resistor 16. On the occasion of bonding a ball 42 to the pad with a capillary 3, a current i flows through wire 41, ball 42, p-n junction 13 and resistor 16 and thereby an output O1 can be obtained. Thereby, the ball 42 is not separated. Wire in the side of lead 22 can be detected as in the case of conventional method. When a reference current is previously set for detection, adequacy of bonding can be judged by this structure.</p> |
