| 摘要 |
<p>1,254,120. Cutting by lasers. WESTERN ELECTRIC CO. Inc. 13 Dec., 1968 [19 Dec., 1967], No. 59316/68. Heading B5E. [Also in Divisions C1 and H1] In order to separate a substrate 16 into two portions a laser beam 12 of sufficient power to produce a localized thermal shock to generate a localized fracture through the entire thickness of the substrate 16 is directed on to the surface of the substrate and relative movement between the substrate and beam is produced so that the fracture is propagated along the boundary between the two portions. The substrate 16 such as glass, ceramic, quartz, sapphire or a slice of semi-conductor such as germanium or silicon upon which electrical circuits or components may be mounted is positioned on movable carriage 18. A laser beam 12 from C.W. molecular gas laser 11 is focused on to a point 13 on the substrate and is of such power that due to the resulting local temperature gradient at point 13 producing expansion of the substrate a localized fracture is formed, Fig. 3 (not shown), extending through the substrate. As the substrate 16 is moved on carriage 18, the fracture follows the line of the beam on the substrate. The substrate may be supported on a pair of knife edges to reduce the energy transferred to the carriage. Fig. 2 (not shown). Examples are given of various beam power levels for different substrate materials, thicknesses and displacement rates.</p> |
