METHOD OF DIPPING PRINTED BOARD IN SOLDER,申请号JP19760149635-传众专利搜索

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发明名称	METHOD OF DIPPING PRINTED BOARD IN SOLDER
摘要
申请公布号	JPS5373370(A)	申请公布日期	1978.06.29
申请号	JP19760149635	申请日期	1976.12.13
申请人	FUJITSU LTD	发明人	MATSUZAWA ZENICHI
分类号	H05K3/34;B23K1/08;B23K31/02	主分类号	H05K3/34
代理机构		代理人
主权项
地址

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