| 摘要 |
1,271,576. Semi-conductor devices. PHILIPS ELECTRONIC & ASSOCIATED INDUSTRIES Ltd. 25 July, 1969 [30 July, 1968], No. 37572/69. Heading H1K. In a semi-conductor device comprising a plurality of metal strip conductors 6, 7, wherein a semi-conductor integrated circuit 8 is mounted on one of the conductors 6 and has electrical connections 9 to the conductors, the conductor 6 on which the integrated circuit is mounted is secured to cooling means, such as a metal block 11, on its side opposite the integrated circuit, and the whole device except the free ends of the conductors is accommodated in an inner envelope 12 of insulating synthetic material and a further outer envelope, (3) not shown, also of insulating synthetic material. The metal block used for cooling is of copper, and may in turn be connected as by a heat conducting adhesive to a heat conducting plate of aluminium where high power is to be dissipated, part of this aluminium plate projecting from the outer envelope of synthetic material, Fig. 7, not shown. |
