| 摘要 |
A printed circuit board guide and holding device which is particularly adapted for use with metallic printed circuit boards, and which has improved heat transfer capabilities comprises an elongated heat transfer support member which is adapted to receive the printed circuit board engaging means. The heat transfer support member is of generally U-shaped cross section and is made of metallic material, with the upstanding arms including spaced flanges to enable the passage therethrough of the edge of the printed circuit board. One of said flanges includes a depending heat conductive element that is adapted to directly engage and be in intimate contact with the metallic printed circuit board to facilitate the conductive transfer of heat from the board to the support member.
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