| 发明名称 |
HERMETIC SEALING METHOD OF SEMICONDUCTOR DEVICE |
| 摘要 |
<p>PURPOSE:To save high temperature treatment processes at least once by bonding a semiconductor chip to a lead conductor which is integrated in the form of a lead frame, connecting each electrode of the chip to each lead conductor by fine metal wires, thereafter sealing the chip in a ceramic base and a ceramic cap by using low melting point bonding glass.</p> |
| 申请公布号 |
JPS5368573(A) |
申请公布日期 |
1978.06.19 |
| 申请号 |
JP19760144309 |
申请日期 |
1976.11.30 |
| 申请人 |
MITSUBISHI ELECTRIC CORP |
发明人 |
ARAINOBU HIROHARU;SOGOU TOSHIO;KAMEDA TOORU |
| 分类号 |
H01L23/12;H01L21/48;H01L23/02 |
主分类号 |
H01L23/12 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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