发明名称 IC DIE BONDING METHOD
摘要 PURPOSE:To detect a desired electrode part without the influence of noises on a pedestal surface by detecting a pattern taking a plural number of electrode parts to be detected and only the evaporated aluminium film part close to the electrode parts as white.
申请公布号 JPS5367359(A) 申请公布日期 1978.06.15
申请号 JP19760142745 申请日期 1976.11.27
申请人 MITSUBISHI ELECTRIC CORP 发明人 HIRATA YOUJI;KOSAKA NORIYUKI
分类号 H01L23/50;H01L21/58;H01L21/60 主分类号 H01L23/50
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