| 发明名称 |
PHOTOGRAPHIC PROCESSING METHOD OF SEMICONDUCTOR WAFERS |
| 摘要 |
PURPOSE:To facilitate photographic processing of semiconductor wafers by bonding a transparent thin plate for mask to transparent plate for supporting and using an exposure mask which is so arranged as to give atmospheric pressure in the space between both. |
| 申请公布号 |
JPS5362475(A) |
申请公布日期 |
1978.06.03 |
| 申请号 |
JP19760138077 |
申请日期 |
1976.11.16 |
| 申请人 |
SONY CORP |
发明人 |
MIFUNE TADAYOSHI;NAKANE YASUAKI;MORI IWAO |
| 分类号 |
H01L21/027;G03F7/20;H01L21/312;H05K3/06 |
主分类号 |
H01L21/027 |
| 代理机构 |
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代理人 |
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| 地址 |
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