| 发明名称 |
PRODUCTION OF RESIN SEAL TYPE SEMICONDUCTOR DEVICE |
| 摘要 |
PURPOSE:To eliminate resin flash and at the same time to improve the heat radiating characteristics of the device by preventing the resin from going round to the underside of a header at the time of resin sealing. |
| 申请公布号 |
JPS5348471(A) |
申请公布日期 |
1978.05.01 |
| 申请号 |
JP19760122796 |
申请日期 |
1976.10.15 |
| 申请人 |
HITACHI LTD |
发明人 |
IMAI TAKAGA |
| 分类号 |
H01L23/48;H01L21/48;H01L23/08;H01L23/12;H01L23/28 |
主分类号 |
H01L23/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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