| 摘要 |
<p>1506450 Conductive compositions SIEMENS AG 19 Aug 1975 [18 Sept 1974] 34354/75 Heading C1M A paste, for use in producing thick-film conductor paths 2, comprises a suspension of a powder mixture in an organic carrier medium, the powder mixture comprising, to an extent of at least 95% (by weight), 4-10% silver, 47-55% aluminium, and 41-44% glass. The silver and aluminium are preferably of particle size 6-20 Á, and the glass of size 5-30 Á. The powder may comprise 0-5% of Bi 2 O 3 . The organic carrier preferably consists of a solution of 10% by weight of ethyl cellulose in a mixture of terpined isomers. The paste is applied to a substrate 1 (e.g. a glass or ceramic) in a desired pattern of the conductive paths 2 (e.g. by silkscreen printing), dried, and baked at 850-1000‹ C. in a furnace which is flushed with air. A resistance paste may then be applied and baked (e.g. at 850‹ C.) to form resistors 3 and 4, and an Ag-Pd paste applied and baked (e.g. at 850‹ C.) to form solderable conductor areas 5.</p> |
