| 摘要 |
<p>PURPOSE:To fully automate the fabrication of a diode chip or the like by containing and conveying divided semiconductor chips while regularly aligning the chips to eliminate the necessity of checking or realigning the aigned chips by a manual work. CONSTITUTION:A semiconductor wafer 1 to be divided into a plurality of chips is so adhered to a retainer jig 2 of transparent member having recesses 2a-2c responsive to the number of chips through wax 3 that the chip regions face oppositely the recesses 2a-2c, respectively. Then, the wafer 1 on the jig 2 is divided into independent chips 1a-1f, the wax 3 is dissolved and removed by solvent in adhered state, and the chips 1a-1f are accommodated in the recesses 2a-2c, respectively of the tool 2.</p> |
