| 发明名称 |
SEMICONDUCTOR DEVICE |
| 摘要 |
PURPOSE:To avert the production of cracking even at the time of die bonding by an autectic alloy method and make the device substantially adaptable for automating and speed changing by providing a polycrystalline semiconductor layer between a semiconductor substrateand a stem.
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| 申请公布号 |
JPS5323569(A) |
申请公布日期 |
1978.03.04 |
| 申请号 |
JP19760098478 |
申请日期 |
1976.08.18 |
| 申请人 |
TOKYO SHIBAURA ELECTRIC CO |
发明人 |
HATSUTORI TSUKASA;YAMAMOTO YOSHIO;OOE KUNIYOSHI;MINAMIYAMA TAKAYUKI;USUDA OSAMU |
| 分类号 |
H01L21/52;H01L21/28;H01L23/12;H01L29/43 |
主分类号 |
H01L21/52 |
| 代理机构 |
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