METHOD FOR TEMPORARILY ADHERING WAFER AND METHOD FOR MANUFACTURING THIN WAFER

摘要

PROBLEM TO BE SOLVED: To provide: a wafer processing body and a temporary adhesive material for wafer processing which facilitate temporary adhesion and peeling, are excellent in CVD (chemical vapor phase growth) resistance, and can enhance productivity of a thin wafer; and a method for manufacturing a thin wafer using the same.SOLUTION: A temporary adhesive material for wafer processing has a composite temporary adhesive material layer 2 having a three-layer structure of: a first temporary adhering layer which is adhered to the surface of a wafer 1 in a peelable manner and is formed of a non-silicone thermoplastic resin layer (A); a second temporary adhering layer which is formed of a thermosetting siloxane polymer layer (B); and a third temporary adhering layer which is adhered to a support 3 in a peelable manner and is formed of a thermosetting siloxane modified polymer layer (C). A method for temporarily adhering a wafer to a support includes: obtaining a wafer laminate in which the resin layer (A) is formed on the surface of a wafer and then a thermosetting silicone composition layer is formed thereon; obtaining a support laminate in which a siloxane-containing composition layer is formed on a support; and then bonding the thermosetting silicone composition layer to the siloxane-containing composition layer.SELECTED DRAWING: Figure 1