| 摘要 |
<p>The Parent patents describe the dielectric heating of food products in sealed containers, immersed to below the filling level in a liquid across which an electromagnetic high-frequency is applied. An electromagnetic ultrahigh-frequency field is applied to the top from above. The containers have on the top an outward flange on which a lid is fixed by hot sealing or welding. A mask is applied to the joint between container and lid for the duration of the UHF radiation procedure. This does not impede the desired heating of the top portion by the UHF radiation which kills the germs. The joint itself is not heated so that solid remnants from splashes produced during filling cannot cause high dielectric losses, nor can the hot sealing wax become soft and produce a leakage.</p> |
