发明名称 FLEXIBLE PRINTED CIRCUIT BOARD AND PROCESS FOR ITS PRODUCTION.
摘要 <p>This improved flexible printed circuit board comprises an insulating material (1) and a conductive substance (2). (1) contains a weakly heat-swelling resin, which has a structural unit represented by general formula (I), (II) or (III), where Ar1 represents a 4-valent aromatic gp.; Ar2 represents the gps. (i), (ii) or . R1-R8 are independently the same or different, lower alkyl gps., lower alkoxy gps. or halogen atoms; n1-n8 are independently 0, 1, 2, 3 or 4. In the formula (II) at least one of (R1)n1 and (R2)n2 must be a methoxy gp. The insulating material (1) has a bending resistance against more than 5,000 bendings and a linaer swelling coefft. of 7 x 10 power (-5) (K(-1)) or less. The flexible printed circuit board is produced by directly coating a soln. of a weakly swelling resin contg. a polyamidoimide precursor on a conductive substance and hardening it.</p>
申请公布号 EP0297139(A1) 申请公布日期 1989.01.04
申请号 EP19870906211 申请日期 1987.09.25
申请人 NIPPON STEEL CHEMICAL CO. LTD. 发明人 WATANABE, HISASHI
分类号 B32B15/08;C08G73/14;H01B3/30;H05K1/03;(IPC1-7):H05K1/03 主分类号 B32B15/08
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