| 摘要 |
The cooling device, especially for a thyristor at any potential desired, has at least one cooling body which is in thermal contact with the semiconductor body and through which a liquid flows continuously. It is known to remove the lost heat in semiconductor elements by means of air or oil. A suitable cooling medium with better properties would be water, but hitherto the problems of electrolysis arising from the use of water have not been manageable. The cooling device is designed to be suitable for water as a cooling medium. The cooling body therefore consists of a cooling plate (2) and a distributor plate (1), the cooling plate (2) being provided with a groove (3) for the cooling liquid to flow through. The distributor plate (1) has, at the inlet and/or outlet point of the cooling liquid, a chamber (10, 11) which has a larger cross-section than the groove (3). Arranged in this chamber (10, 11) there is an electrode (12) which consists of a readily conductive material which is chemically resistant to the cooling medium. <IMAGE> |
