| 发明名称 |
PROCESS FOR ELECTROLYTIC BUFFING |
| 摘要 |
PURPOSE:To efficiently finish the grinding surface to a mirror surface by setting the area of an exposed electrode of a tool at a ratic of 20 to 50% with respect to the area of a grinding member, and turning the electrode of the tool by pressing it onto the surface being ground. |
| 申请公布号 |
JPS5313291(A) |
申请公布日期 |
1978.02.06 |
| 申请号 |
JP19760088006 |
申请日期 |
1976.07.22 |
| 申请人 |
HITACHI SHIPBUILDING ENG CO |
发明人 |
KIMOTO YASUO;TAMIYA KATSUTSUNE;HONDA SHIYOUICHI |
| 分类号 |
B23H5/00;B23H5/10;C25F3/16 |
主分类号 |
B23H5/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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