发明名称 |
Ultra-thick thick films for thermal management and current carrying capabilities in hybrid circuits |
摘要 |
Disclosed is an ultra-thick thick film of copper or silver or other suitable conductor material for use in spreading heat laterally, i.e., in the x and y directions, along a substrate. A substrate of suitable thickness is chosen to dissipate heat in the vertical or z-direction underneath a heat generating component such as a semiconductor chip. The ultra-thick films have a thickness ranging from about 2 to about 5 mils and are prepared from metal powders having average particles sizes ranging from about 1 micron to 3 microns.
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申请公布号 |
US5395679(A) |
申请公布日期 |
1995.03.07 |
申请号 |
US19930038379 |
申请日期 |
1993.03.29 |
申请人 |
DELCO ELECTRONICS CORP. |
发明人 |
MYERS, BRUCE A.;SARMA, DWADASI H. R.;KOLLIPARA, ANIL K.;PALANISAMY, PONNUSAMY |
分类号 |
H01L21/52;H01L23/12;H01L23/373;H05K7/06;H05K7/20;(IPC1-7):B32B9/00 |
主分类号 |
H01L21/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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