首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
METHOD FOR FORMING INSULATING TRENCH IN SUBSTRATE FOR SMART POWER CHIP
摘要
申请公布号
JPH0799240(A)
申请公布日期
1995.04.11
申请号
JP19940160624
申请日期
1994.06.20
申请人
SIEMENS AG
发明人
UDO SHIYUWARUKE
分类号
H01L21/225;H01L21/76;H01L21/762;H01L27/12;(IPC1-7):H01L21/762
主分类号
H01L21/225
代理机构
代理人
主权项
地址
您可能感兴趣的专利
SHEET FEEDER
Attribute information presenting apparatus and multimedia system
Extrusion system
Immunostimulatory nucleic acid molecules
Non-perpendicular optical paths for a crosstalk-inhibiting switching arrangement
Switching power supply with AC waveform capability
Developing device, process cartridge, electrophotographic image forming apparatus and agitating member
Travel coach air conditioning system
High speed analog to digital conversion circuitry using quantum mechanical tunneling structures
Padding for a vehicle seat
Polyamide acid composition containing metal, polyimide film, flexible printed wiring board and method for producing them
External electrode for a monolithic multi-layer actuator
Signal coding system
EMI reduction for optical subassembly
Prevent passivation from keyhole damage and resist extrusion by a crosslinking mechanism
Web browser download of bookmark set
Method and system of determining access to records of members of a community
Electroporation apparatus with connective electrode template
Computer, keyboard, and flat screen monitor support assembly
Compounds and methods for depositing pure thin films of gallium nitride semiconductor