首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
摘要
申请公布号
JPS535238(U)
申请公布日期
1978.01.18
申请号
JP19760083935U
申请日期
1976.06.28
申请人
发明人
分类号
B65D1/38;B65D25/22;(IPC1-7):B65D25/22
主分类号
B65D1/38
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Multi-layer circuit having a via matrix interlayer connection and method for fabricating the same
Plastic solder array using injection molded solder
Method for forming via hole and semiconductor structure formed thereby
Semiconductor device and method for manufacturing the same, and semiconductor memory device and method for manufacturing the same
Method of making chip size package substrate
Surgical method and apparatus for positioning a diagnostic or therapeutic element within the body
PRODUCTION OF OPTICAL ELEMENT
TAKE-OUT MECHANISM OF MACHINE FOR PRODUCING BOTTLE
PRODUCTION OF EMULSION COMPOSITION CONTAINING SILICONE AND CLAYEY MINERAL, AND COSMETIC CONTAINING THE EMULSION COMPOSITION
PERIODONTAL DISEASE-THERAPEUTIC MATERIAL
PRODUCTION OF INP SINGLE CRYSTAL
EXPLOSIVE COMPOSITION
PRODUCTION OF ZEOLITE MOLDED PRODUCT
PRODUCTION OF MAGNETITE AND APPARATUS FOR PRODUCING MAGNETITE
SIDE FORKLIFT TRUCK
IMAGE FORMING DEVICE
FLAT MATERIAL CARRYING DEVICE
SCREW CONVEYOR EXCELLENT IN COOLING POWER
CONVEYOR BELT SUPPORTING MECHANISM
CARRIAGE FACILITIES
