Solderable low ohmic film resistor paste with low temp. coefft. - contg. two or more of chromium, manganese, iron, cobalt, nickel and copper

摘要

Paste for the prodn. of solderable, low-ohmic film resistors with small temp. coefft. contains an electrically conducting constituent (I), a citreous constituent (II) and an organic pasting agent (III), (I) contg. at least 2 of the element Cr, Mn, Fe, Co, Ni and Cu. Pref. (I) consists of 20-70% Ni and 30-80% Cu and the paste contains 40-80% (I), pref. 62-70% (I) and 8-12% (III). The resistor is pref. produced by aplying the paste to a (ceramic) substrate and firing at 700-1100 degrees C under a protective gas. Used for the prodn. of film resistors with a surface resistivity of 0.05-1 ohm/sq. and a temp. coefft. below 50 ppm/degrees C.