| 摘要 |
<p>The housing for microwave communications appts. employing printed circuits and component substrates uses a profile element which defines a rectangular frame (1) forming the sides of the housing. A cover plate (2) is fitted to one side of this frame (1) and a base plate (3) on which the circuit boards (5) etc. can be mounted, is fitted to the other side. A number of dividing walls (2) project inwards at right angles from the sides of the frame (1), so that the housing is divided internally into a number of chambers receiving respective circuit boards.</p> |
