| 摘要 |
<p>PROBLEM TO BE SOLVED: To contrive miniaturization and a low cost by thinning with high precision and high function. SOLUTION: A peeling layer forming process for forming a peeling layer 6 on a main face flattening a base board 1, an insulation layer forming process for forming insulation layers 7, 9, 16 on the peeling layer 6, a wiring layer forming process for forming wiring layers 8, 11, 14 on the insulation layer 7, and a circuit block body peeling process for peeling a circuit block body 2 comprising each insulation layer and wiring layer through the peeling layer are provided. The circuit block body 2 incorporates film formation elements 12, 13, 17 in the wiring layer, and is mounted on a base board 3 to compose a wiring device. The circuit block body 2 mounts a semiconductor chip 62 on the surface and is mounted on a base board 64 to compose a semiconductor device.</p> |
