发明名称 HEAT SPREADER, SEMICONDUCTOR PACKAGE MODULE AND MEMORY MODULE HAVING THE HEAT SPREADER
摘要 <p>A heat spreader includes a heat sinking plate and a pressure clip. The heat sinking plate radiates the heat away from a heat source. The pressure clip fixes the heat sinking plate to the heat source. The pressure clip includes a spine (pressing part), one or more ribs and hook parts. The spine is arranged on the heat sinking plate. The one or more ribs extend from the spine and contact the heat source. The hook parts extend from the spine and are supported by the heat source. The pressure clip further includes mounting parts that couple the spine to the hook parts. A bending space is formed between the spine and the heat sinking plate. The heat spreader may be attached to a printed circuit board (PCB) with, e.g., a one-touch method, so that assembling processes of the memory module may be automated.</p>
申请公布号 KR100693920(B1) 申请公布日期 2007.03.12
申请号 KR20050061309 申请日期 2005.07.07
申请人 发明人
分类号 H01L23/36 主分类号 H01L23/36
代理机构 代理人
主权项
地址
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