| 摘要 |
<p>An electroplated deposit of noble metal, esp. gold, is achieved simultaneously on numerous metal bases and their connector pins. Before the partial immersion of the bases in the electrolyte, their pins are inserted in a jig connected to the negative pole of an electric current supply. The jig consists of a metal profile with a trapezoidal cross-section; the two sides of the profile contain holes with adjacent slots, forming spring tongues for holding the pins so the flat part of the profile faces the underside of the base to which the pins are attached. The jig is pref. made of bent stainless steel- or beryllium copper- strip, where the sides form an angle of min. 15 degrees, and pref. 20 degrees with the flat part of the strip, which may contain holes opposite the bases. Used for the selective electroplating of can bases employed for holding semiconductor chips, e.g. a TO-5 or other can base. Rapid loading and unloading of the bases in the jig, and good electrical contact, are achieved.</p> |
