Semiconductor chip with controlled defects on surface - has uniform distribution of Hertzian fractures and microsplits

摘要

A semiconductor chip which is manufactured with specific defects on one surface. This produces zones with an ordered arrangement of impurities, stacking faults, displacements, holes and other defects which can be reproduced and homogenously kept free. The defects are uniformly distributed across the surface of the chip and have a defined depth. The semiconductor material is made from silicon. The defects are in the form of Hertzian fracture cones and micro-splits. The surface is subjected to impact stressingly by placing a large number of spherically shaped objects on the surfaces which are then vibrated. The vibration frequently corresponds to the natural frequency of the chip.