发明名称 |
Electroless copper plating solution |
摘要 |
An electroless copper plating solution comprising a copper salt, complexing agent, reducing agent, alkali hydroxide and aliphatic perfluorocarbon-containing non-ionic surface active agent is suitable for producing copper deposition having high ductility and good appearance, and further such a solution is very stable even at a high temperature.
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申请公布号 |
US4059451(A) |
申请公布日期 |
1977.11.22 |
申请号 |
US19760704618 |
申请日期 |
1976.07.12 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
OITA, MASAHIRO;HIROHATA, HYOGO;HAMASAKI, NOBUHIRO |
分类号 |
C23C18/40;(IPC1-7):C23C3/02 |
主分类号 |
C23C18/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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