UN APARATO PARA ROMPER UN DISCO SEMICONDUCTOR A LO LARGO DE LINEAS PREVIAMENTE MARCADAS.

摘要

An apparatus is disclosed for breaking apart, pre-scribed chips in a semiconductor wafer. The apparatus comprises a plurality of ball elements having a diameter substantially smaller than the diameter of the wafer, mounted in a support beneath the contacting plane. Located above and in spaced coaxial relationship with the ball elements is a plurality of purging gas/vacuum ports. The pre-scribed semiconductor wafer is mounted on an elastic film by means of an adhesive coating thereon.