| 摘要 |
The admixing of a small amount of an organosilicon compound containing at least one siliconbonded hydrogen atom per molecule with curable compositions comprising a hydroxyl-containing organosilicon compound, an epoxy compound and certain catalytic aluminum compounds to improve the performance of the cured composition is disclosed. The improved compositions are especially useful as a resin binder in molding compounds that are used to mold electronic devices. |
