| 摘要 |
1285708 Semi-conductor devices JOSEPH LUCAS (INDUSTRIES) Ltd 2 Oct 1969 [28 Oct 1968 16 May 1969] 5l035/68 and 24991/69 Heading HlK A plurality of similar semi-conductor devices are manufactured from one wafer by channelling the wafer, positioned on a support, and protecting the exposed regions of the devices with a curable compound prior to curing the compound and separating the devices. The wafer is formed with a P-N junction by known diffusion techniques and a metal deposited on its surfaces. The wafer is secured to a slide 11 by a layer 12 of wax, and a second layer of wax sprayed on to the other side of the wafer through a steel mask containing a plurality of rectangular apertures, forming rectangular areas 13 of wax on the wafer. The wafer is etched to remove the material lying between the areas 13 causing channels 14 to be formed through the wafer. The wafer is washed and dried and a solution of 5% silicone resin, a catalyst, and a volatile carrier, poured into the channels. The wafer is warmed to remove the carrier and heated to cure the resin which forms a protective adherent film 17 on the edges 16 of the devices 15. The wax is removed with a solvent and leads soldered to the metal areas on each device. The silicone resin may be of the form where R is the methyl group, or where R is an aryl or alkyl grouping phenyl or methyl being preferred respectively, or a mixture of the two forms. The catalyst may be zinc acetate, and the carrier alcohol or ketone. In a second embodiment, also described in Specification 1,285,709, a silicon-base crosslinked synthetic rubber material, in liquid form, may be poured into the channels and cured. The wax is removed leaving a plurality of devices interconnected by a rubber membrane. |
