Breadboard circuit card for integrated circuit chips - has wire wrapped interconnections made using wire threaded through holes in circuit card

摘要

The circuit 'bread boarding' technique is used with dual-in-line integrated circuit chips. The board has a matrix of holes and wire wrapped interconnections. Supply rails are located on either side of the board for the applied voltage and earthing cross rail projections span two sets of holes spaced at a distance corresponding to the terminal bars of integrated circuit chips. An intermediate row of larger diameter holes are located between each row of chips to allow lacquered copper wire to be passed for interconnection purposes.