发明名称 |
Method for customizing nucleate boiling heat transfer from electronic units immersed in dielectric coolant |
摘要 |
A method is provided for customizing the heat transfer from the walls of an electronic unit such as a semi-conductor chip or wafer by determining the required heat transfer characteristics of the units; drilling holes of a predetermined size and location in the walls of the unit with a high energy beam in accordance with the required heat transfer characteristics of the unit; immersing the unit in a suitable dielectric coolant so that nucleate boiling will start at approximately the desired wall temperature to obtain the required heat transfer from the unit, thereby providing a uniform wall temperature.
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申请公布号 |
US4050507(A) |
申请公布日期 |
1977.09.27 |
申请号 |
US19750591198 |
申请日期 |
1975.06.27 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CHU, RICHARD C.;MORAN, KEVIN P. |
分类号 |
H01L23/42;F28F13/18;H01L23/427;(IPC1-7):F28D5/00 |
主分类号 |
H01L23/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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