| 摘要 |
<p>Lead frames are bonded to thin-film bonding sites on brittle substrates by a bonder which compensates for, inter alia, substrate contour variations to substantially reduce substrate cracking. The bonder includes, for each bonding site, a separate pair of lever arms registered both with said bonding site and the associated lead to be bonded thereto, the arms of each pair being mounted on separate parallel shafts and in parallel with corresponding arms of other pairs. An operating means concurrently rotates the arms independently around their respective shafts and into contact with the substrate and leads before an equal bonding force is simultaneously applied to each bonding site.</p> |
