发明名称 Process for the production of a bipolar integrated circuit
摘要 A method of making a bipolar integrated circuit which requires neither an epitaxial layer nor a buried layer. The required doping of a semiconductor substrate, e.g., silicon, is obtained by a series of etching steps alternated with ion implantation steps of a selected impurity type, and heat treatment steps. The emitter and collector zones of a transistor are formed on sloping walls of adjacent troughs formed in a semiconductor substrate. The base zone of a transistor is formed on the confronting sloping wall of one of these troughs. Lead conductors are located in the troughs along sloping wall portions of the troughs.
申请公布号 US4047975(A) 申请公布日期 1977.09.13
申请号 US19760702062 申请日期 1976.07.02
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 WIDMANN, DIETRICH
分类号 H01L21/761;H01L21/00;H01L21/266;H01L21/331;H01L21/8222;H01L27/00;H01L29/73;H01L29/735;(IPC1-7):H01L21/26;H01L21/30 主分类号 H01L21/761
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