发明名称 Semiconductor circuit assemblies
摘要 988,075. Semi-conductor solid circuits; circuit assemblies. FERRANTI Ltd. April 24, 1963 [April 27, 1962], No. 16085/62. Headings H1K and H1R. A semi-conductor assembly includes several slices of semi-conductor material each with an electric circuit formed at one face. The circuits are interconnected by deposited conductive strips on the face of an insulating block abutting the slices to which strips the circuit terminations on the slices are bonded via metal particles sandwiched between the block and the slices. In the embodiment (Fig. 1) the slices 1 are of silicon and the circuit terminations 2 of aluminium (Fig. 2). Several evaporated aluminium conductors 4 on one face of a ceramic block 3 interconnect the slices 1 by means of gold particles 5 located in conical identations 6 in the face of the block 3. In manufacture after dusting the ceramic block surface with gold particles a jig (Fig. 3, not shown) is secured to the block 3 and used to orient the circuit terminations on the semiconductor slices with respect to the gold particles after which the assembly is heated to 350‹ C. and sufficient pressure exerted between the slices 1 and the block 3 to form a compression bond between the gold particles and the conductors 4 and conductors 2. After bonding a metal cap 8 is cold welded to a rigid frame 9 to enclose the assembly. Conductors 2 and particles 5 may be alternatively of gold and aluminium respectively.
申请公布号 US3379937(A) 申请公布日期 1968.04.23
申请号 US19630275412 申请日期 1963.04.24
申请人 FERRANTI, LIMITED 发明人 SHEPHERD ALAN ARTHUR
分类号 H01L21/60;H01L21/607 主分类号 H01L21/60
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