发明名称 |
Soldering process for circuit board - protectively coats those conductor paths not requiring soldering and tins others |
摘要 |
<p>The soldering process, for circuit boards, chemically treats those conducting paths that are not to be soldered so that an insulating coating is formed over them that prevents their being wetted by the solder and provides protection against corrosion. The soldering eyes and the metallised through-connections are covered with a protective coat of tin that inhibits the action of bichromate. The circuit board is then treated with a bichromate solution and finally with a silicate solution.</p> |
申请公布号 |
DE2605529(A1) |
申请公布日期 |
1977.08.25 |
申请号 |
DE19762605529 |
申请日期 |
1976.02.12 |
申请人 |
LICENTIA PATENT-VERWALTUNGS-GMBH |
发明人 |
KUENZIG,HERBERT |
分类号 |
B23K35/22;H05K3/34;(IPC1-7):05K3/34 |
主分类号 |
B23K35/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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